Design and Development of hybrid Integrated MEMS Capacitive Gyroscope-ROIC Module

Jain, A and Gudlavalleti, RH and Bose, SC and Gopal, R (2019) Design and Development of hybrid Integrated MEMS Capacitive Gyroscope-ROIC Module. In: International Workshop on Physics of Semiconductor Devices(IWPSD) 2017, December 11-15, 2017, New Delhi. (Submitted)

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Abstract

Abstract— IU this papcr, we arc reporting rhc dcve1opm0nt of” z MEMS capacitive gyroscope-RO IC module for possible use in micro aerial vehicle (being de- veloped by CSIR-NAL). The gyroscope is fabricated using an SU-8 based UV- LIGA process. The associated ROIC is designed in-house and is fabricated through Euro-practice in AMS 0.35 qm CMOS technology. The sensor and the ROIC chips are hybrid integrated and vacuum packaged in a 24-pin dual-in-line package to make the module. The module is tested for its spectral and rate re- sponses.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Keywords: Gyroscope, Hybrid integration, MEM S, ROIC, Vacuum packa8ing
Subjects:	Semiconductor Devices > MEMS and Microsensors
Divisions:	Semiconductor Devices
Depositing User:	Mr. Rabin Chatterjee
Date Deposited:	04 Dec 2019 09:16
Last Modified:	04 Dec 2019 09:16
URI:	http://ceeri.csircentral.net/id/eprint/339

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