Design of Vertical Packaging Technology for RF MEMS Switch

Bansal, D and Sharma, A and Kaur, M and Rangra, KJ (2011) Design of Vertical Packaging Technology for RF MEMS Switch. In: 16th International Workshop on the Physics of Semiconductor Devices (IWPSD - 2011), December 19 - 22, 2011, IIT Kanpur, India. (Submitted)

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Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This article presents an approach for design and processing steps related to encapsulation of individual RF components e.g. CPW, RF MEMS switches, in view of the variation in performance subsequent to packaging. Bottom contact vertical packaging is more prone to misalignment margin and easy to make connections. Cavity height of 30 µm is optimized for bottom contact vertical packaging.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	RF MEMS, CPW, encapsulation,
Subjects:	Semiconductor Devices > MEMS and Microsensors Semiconductor Devices > Sensors and Nanotechnology
Divisions:	Semiconductor Devices
Depositing User:	Mr pvlr reddy
Date Deposited:	27 May 2013 09:44
Last Modified:	12 Jan 2017 09:29
URI:	http://ceeri.csircentral.net/id/eprint/203

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