Effect of Temperature on Etch Rate and Undercutting of (100) Silicon using 25% TMAH


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Kumar, SS and Pant, BD (2013) Effect of Temperature on Etch Rate and Undercutting of (100) Silicon using 25% TMAH. In: International Conference on Emerging Technologies : Micro to Nano 2013 (ETMN-2013), February 23-24, 2013, BITS, Pilani, K.K. Birla Goa Campus, Goa. (Submitted)

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Silicon etching using aqueous Tetra-Methyl Ammonium Hydroxide (TMAH) provides a simple and cost effective technique for the fabrication of diaphragms. The etching of {111} planes leads to undercutting, causing a deviation in the designed size of diaphragm. This induces variation in the designed characteristics of the device. It is necessary to estimate and minimize this deviation. In the present work, the etch rates in the {100} and {111} planes for 25% wt TMAH have been empirically estimated at different temperatures. Based on these results the undercut was estimated and a relationship has been established between the etch rate ratio for the two planes. These findings are extremely useful in the fabrication of silicon diaphragms with precise dimensions.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: TMAH etching, Piezoresistive pressure sensor, temperature dependence, undercutting
Subjects: ?? TK ??
Semiconductor Devices > Sensors and Nanotechnology
Divisions: Semiconductor Devices
Depositing User: Mr. Rabin Chatterjee
Date Deposited: 23 May 2013 09:08
Last Modified: 24 May 2013 05:48
URI: http://ceeri.csircentral.net/id/eprint/62

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