Sharma, A and Bansal, D and Rangra, KJ and Kumar, D (2012) A Test Structure for In-situ Determination of Residual Stress. In: IEEE Sensors 2012, October 28 - 31, 2012 , Taipei, Taiwan. (Submitted)
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Abstract
This work presents a lancet type residual stress measurement test structure which comprises of a pair of bent beams along with cantilevers as driving bars for the rotational pointer structure. The residual stress causes the bent beams to deflect each other, thereby magnifying the pointer deflection. The pointer deflection direction indicates the type of stress (compressive or tensile), with the displacement being independent of Young’s modulus and film thickness. Finite element modeling is also used to analyze the structure and is compared with experimental results of electroplated Au structures.
Item Type: | Conference or Workshop Item (Paper) |
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Uncontrolled Keywords: | MEMS, residual stress, test structure, FEM analysis, |
Subjects: | ?? TK ?? Semiconductor Devices > Sensors and Nanotechnology |
Divisions: | Semiconductor Devices |
Depositing User: | Mr. Rohit Singh |
Date Deposited: | 23 May 2013 09:25 |
Last Modified: | 27 May 2013 10:08 |
URI: | http://ceeri.csircentral.net/id/eprint/51 |
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