Optimization of LTCC Structure for Stable Interconnections

Kharbanda, D and Khanna, PK and Kumar, S and Sharma, IC (2013) Optimization of LTCC Structure for Stable Interconnections. In: 1st National Conference on Micro and Nano Fabrication (MNF-2013), January 21-23, 2013, CMTI, Bangalore. (Submitted)

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Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Low temperature co-fired ceramics (LTCC); Base plate; TCE; Sensor
Subjects: ?? TK ??
Semiconductor Devices > Hybrid Microcircuits
Divisions: Semiconductor Devices
Depositing User: Mr. Jitendra Nath Bajpai
Date Deposited: 24 May 2013 06:07
Last Modified: 24 May 2013 06:21
URI: http://ceeri.csircentral.net/id/eprint/23

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