Thick Photoresist Optimization for MEMS Structures


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Jhanwar, P and Sharma, A and Pandey, S and Bhatia, R and Rangra, KJ and Verma, S (2013) Thick Photoresist Optimization for MEMS Structures. In: International Conference on Emerging Technologies: Micro to Nano 2013 (ETMN - 2013), February 23-24, 2013, Goa, India. (Submitted)

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Thick photoresist applications have been a key field of interest in recent years for fabrication of microstructures. Besides bump fabrication and wire interconnect technology, the method of patterning thick layer photoresist by UV lithography is specially developed for MEMS applications. In this paper, a new photoresist AZ9260 (commercially available) is optimized for various thicknesses and the effect of speed and ramp on the thickness is analyzed with a set of experiments. Thickness of 6 μm, 9.8 μm, and 14 μm has been optimized with a smooth surface profile at a ramp of 5000 rpm/sec. The spin speed and ramp affects thickness and uniformity respectively. The standard deviation for lower and higher ramp is 0.8500 and 0.0933 respectively. Prebaking and exposure times are also optimized. The exposure time is 20 sec and developing time is 130 sec.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: AZ9260, electroplating, positive photoresist, moulds, aspect ratio,
Subjects: ?? TK ??
Semiconductor Devices > Sensors and Nanotechnology
Divisions: Semiconductor Devices
Depositing User: Mr. Rohit Singh
Date Deposited: 23 May 2013 09:23
Last Modified: 23 May 2013 09:23

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